US 2007/0182289 A1 · Electronic component package

Abstract

The present invention is to prevent melted sealant from flowing into the interior of a case of an electronic component package that is provided with a shielding electrode on the inner surface of the case, fill a through-hole with the sealant with reliability, and perform vacuum airtight sealing. The electronic component package 10 has a case 12 that has an opening and stores an electronic component (piezoelectric oscillator 11) in the storage inside, and a lid 16 that is joined to the rim of the opening to cover the opening, and airtightly seals a through-hole 20 provided on the bottom part 12b of the case 12 to communicate with the outside, by using a sealant 30. The electronic component package is provided with a shielding electrode 15 on the inner surface of the case to remove a noise influence, and further provided with a configuration to set a part (nonmetal part 22) between the through-hole 20 and the shielding electrode 15, the part being low in wettability with the melted sealant 30, thereby making it difficult to flow the melted sealant 30 from the through-hole 20 into the case 12 along the shielding electrode 15, preventing the melted sealant 30 from flowing into the case 12.

Claims15

Dependent claims

An electronic component package comprising,

a case that has an opening and stores an electronic component in a storage inside, and a lid that covers the opening, being joined to a rim of the opening, and
airtightly sealing a through-hole by using a sealant, the through-hole being provided on a bottom of the case and communicating with the outside, wherein,
a nonmetal part is provided between a shielding electrode placed on an inner surface of the case and a metal coating placed on an inner periphery of the through-hole communicating with the outside, so as to prevent the sealant being melted from flowing.

A method for manufacturing an electronic component package being an oscillator package, comprising a case that has an opening and stores an oscillator in a storage inside, and a lid that covers the opening, being joined to a rim of the opening, airtightly sealing a through-hole by using a sealant, the through-hole being provided on a bottom of the case and communicating with the outside, and airtightly sealing the oscillator package within a sealing chamber, comprising,

a primary welding step to weld the rim of the case to the lid,
a step to place the sealant in the through-hole,
a sealing chamber inner pressure control step that controls a pressure within the sealing chamber to a predetermined level, and
a secondary welding step that melts the sealant by a laser beam irradiation to seal the through-hole, in a state where the pressure within the sealing chamber is kept to be the predetermined level, wherein,
the predetermined level is decided based on a vibration characteristic of the oscillator.

2 more elements

Dependencies are inferred from the claim text.

Electronic component package

Life of this patent

Electronic component package

Life of this patent

Abstract

Claims15