Integrated circuit packaging system including a non-leaded package
AssigneeSTATS ChipPAC, Ltd.
InventorsJeffrey Punzalan, Henry Bathan, Il Kwon Shim, Keng Kiat Lau
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Abstract
An integrated circuit non-leaded package system is provided including: forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads; configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package; and forming the second terminal ends of alternating leads disposed along the periphery of the package to form a lead-to-lead gap between adjacent leads in excess of the predetermined interval gap.
Claims20
An integrated circuit non-leaded packaging system comprising:
- forming a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads;
- configuring each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package;
- and
- forming the second terminal ends of alternating leads disposed along the periphery of the package to form a lead-to-lead gap between adjacent leads in excess of the predetermined interval gap.
An integrated circuit non-leaded packaging system for fabricating an integrated circuit non-leaded package comprising:
- forming an electrically conductive layer;
- masking the electrically conductive layer to form a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads;
- forming each one of the plurality of leads to include first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along the periphery of a package;
- defining an amount to be removed from the second terminal ends of alternating leads to prevent lead shortage;
- masking the second terminal ends of the alternating leads;
- and
- etching the second terminal ends of the alternating leads to form an etched lead-to-lead gap between adjacent leads at the second terminal ends in excess of the predetermined interval gap.
An integrated circuit non-leaded packaging system comprising:
- a plurality of leads with a predetermined thickness and a predetermined interval gap between each of the plurality of leads;
- each one of the plurality of leads includes first terminal ends disposed adjacent an integrated circuit and second terminal ends disposed along a periphery of a package;
- and
- a lead-to-lead gap formed between the second terminal ends of alternating leads in excess of the predetermined interval gap.
An integrated circuit non-leaded packaging system comprising:
- an integrated circuit pad;
- an integrated circuit, with contact terminals, disposed over the integrated circuit pad;
- a plurality of leads disposed peripherally around the integrated circuit electrically connected to the contact terminals by wires;
- a mold resin for packaging the integrated circuit defining a system periphery;
- the plurality of leads include first terminal ends and second terminal ends, the first terminal ends disposed adjacent the integrated circuit and the second terminal ends disposed along a periphery of the system;
- and
- the second terminal ends of alternating leads are either half-etched or partially half-etched, to widen an etched lead-to-lead gap.
Dependencies are inferred from the claim text.