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US 2007/0181970 A1Published application
High performance system-on-chip inductor using post passivation process
AssigneeMegica Corporation
InventorMou-Shiung Lin
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Abstract
A system and method for forming post passivation inductors, and related structures, is described. High quality electrical components, such as inductors and transformers, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.
Claims36
A circuit component comprising:
- a silicon substrate;
- a metallization structure over said silicon substrate;
- a passivation layer over said metallization structure;
- a first polymer layer on said passivation layer, wherein said first polymer layer has a thickness greater than that of said passivation layer;
- and
- a coil on said first polymer layer, wherein said coil comprises first and second terminals for external connection, not connected to said metallization structure.
3 more elements
A circuit component comprising:
- a silicon substrate;
- a metallization structure over said silicon substrate;
- a passivation layer over said metallization structure;
- a coil over said passivation layer;
- and
- a wirebond pad over said silicon substrate, wherein said wirebond pad is connected to a first terminal of said coil.
3 more elements
A circuit component comprising:
- a silicon substrate;
- a metallization structure over said silicon substrate;
- a passivation layer over said metallization structure;
- a coil over said passivation layer;
- a metal pad connected to a first terminal of said coil;
- a first polymer layer over said coil, wherein an opening in said first polymer layer exposes said metal pad, wherein said opening has a sloped sidewall;
- and
- a solder bump connected to said metal pad.
5 more elements
Dependencies are inferred from the claim text.