Back to results
US 2007/0181851 A1Published application
Polishing composition and polishing method
AssigneeFujimi Incorporated
InventorShuhei Yamada
Life of this patent
Estimating the term…
Abstract
The polishing composition contains polyoxyethylene sorbitan mono-fatty acid ester, silicon dioxide, water soluble cellulose, an alkaline compound, and water. The content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.0025% by mass. The polishing composition is appropriate for final polishing of silicon wafers.
Claims16
A polishing composition comprising:
- polyoxyethylene sorbitan mono-fatty acid ester;
- silicon dioxide;
- water soluble cellulose;
- an alkaline compound;
- and
- water,
- wherein the content of polyoxyethylene sorbitan mono-fatty acid ester in the polishing composition is less than 0.0025% by mass.
4 more elements
A polishing composition comprising:
- polyoxyethylene sorbitan mono-fatty acid ester, the content of which in the polishing composition is no more than 0.0015% by mass;
- colloidal silica, the content of which in the polishing composition is no more than 2.5% by mass;
- hydroxyethyl cellulose, the content of which in the polishing composition is no more than 0.15% by mass;
- an alkaline compound selected from the group consisting of ammonium, potassium hydroxide, sodium hydroxide, tetramethylammonium hydroxide, and tetraethylammonium hydroxide, the content of which in the polishing composition is no more than 0.5% by mass;
- and
- water.
3 more elements
Dependencies are inferred from the claim text.