Sputtering apparatus and anti-adhesion plate therefor

A sputtering apparatus comprising:

• a first cover made of a conductive material and having a first opening through which sputtered particles from a target are released;
• a second cover made of a conductive material and having a second opening through which the sputtered particles released from the first opening impinge on a substrate;
• an O-ring made of an insulating material and having a hollow center portion, the O-ring being disposed between the first cover and the second cover, with the hollow center portion disposed at the first opening and the second opening so that the first opening and the second opening communicate with each other via the hollow center portion;
• a third cover placed over a face of at least one of the first cover and the second cover facing the O-ring, the third cover being made of a conductive material;
• and
• an insulating material between the third cover and the face of the at least one of the first cover and the second cover.