Electronic device cleaning equipment and electronic device cleaning method
OwnerYukihisa Wada, Masayuki Watanabe +1inventors
InventorsYukihisa Wada, Masayuki Watanabe, Kazuhide Saito
Life of this patent
Estimating the term…
Abstract
Electronic device cleaning equipment includes a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed, a vapor supply nozzle for supplying vapor to the obverse face of the substrate, and chemical solution supply means for supplying a chemical solution to the obverse face of the substrate. Accordingly, static electricity present on the obverse face of the substrate is diselectrified.
Claims22
Electronic device cleaning equipment, comprising:
- a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;
- a vapor supply nozzle for supplying vapor to the obverse face of the substrate;
- and
- chemical solution supply means for supplying a chemical solution to the obverse face of the substrate.
Electronic device cleaning equipment, comprising:
- a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;
- a chemical solution nozzle for supplying a chemical solution to the obverse face of the substrate;
- and
- a vapor supply nozzle for supplying vapor to the chemical solution nozzle.
Electronic device cleaning equipment, comprising:
- a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;
- a chemical solution nozzle for supplying a chemical solution to the obverse face of the substrate;
- and
- a conductive cup which retains a solution and is electrically grounded, a discharge port of the chemical solution nozzle being to be dipped into the solution.
Electronic device cleaning equipment, comprising:
- a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed;
- a chemical solution nozzle for supplying a chemical solution to the obverse face of the substrate;
- and
- a conductive member for diselectrifying static electricity present at the chemical solution nozzle, the conductive member being grounded electrically.
An electronic device cleaning method, comprising the steps of:
- (a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;
- (b) supplying vapor to the obverse face of the substrate;
- and
- (c) supplying a chemical solution to the obverse face of the substrate after the step (b).
An electronic device cleaning method, comprising the steps of:
- (a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;
- (b) supplying vapor to a chemical solution nozzle;
- and
- (c) supplying a chemical solution to the obverse face of the substrate from the chemical solution nozzle after the step (b).
An electronic device cleaning method, comprising the steps of:
- (a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;
- (b) dipping a discharge port of a chemical solution nozzle into an electrically grounded solution;
- and
- (c) supplying a chemical solution to the obverse face of the substrate from the chemical solution nozzle after the step (b).
An electronic device cleaning method, comprising the steps of:
- (a) placing, on a processing face of a cleaning stage, a substrate having an obverse face at which an electronic device is formed;
- (b) diselectrifying static electricity present at a chemical solution nozzle with the use of an electrically grounded conductive member;
- and
- (c) supplying a chemical solution to the obverse face of the substrate from the chemical solution nozzle after the step (b).
Dependencies are inferred from the claim text.