Wafer cleaning apparatus and related method

A semiconductor wafer cleaning apparatus comprising:

• a plurality of cleaning process modules, each comprising:
• a wafer stage comprising a spin chuck rotatably supporting a wafer, and a cup surrounding the spin chuck;
• a spray unit comprising a nozzle adapted to spray a first cleaning solution having a dissolved static electricity preventing substance onto a surface of the wafer, and a pressurized-gas supply unit adapted to provide a pressurized gas to the nozzle;
• and,
• a sonic unit comprising an oscillating quartz rod communicating oscillation energy to a second cleaning solution and providing a second cleaning solution mixed with alkali containing hydroxyl onto the surface of the wafer.

A semiconductor wafer cleaning apparatus comprising:

• a plurality of process modules, wherein each process module comprises:
• a wafer stage adapted to rotatably support a wafer;
• a spray unit adapted to spray CO2-dissolved deionized water (DIW) onto a surface of the wafer through a nozzle disposed at an end of a rotatable first arm by providing pressurized nitrogen to the nozzle;
• and,
• a sonic unit adapted to oscillate a quartz rod disposed at an end of a rotatable second arm and adapted to transmit oscillation energy to diluted ammonia water disposed on the surface of the wafer to remove particles from the surface of the wafer.

A method for cleaning a semiconductor wafer comprising:

• spraying CO2-dissolved deionized water (DIW) onto a surface of a wafer;
• moving a quartz rod to into a position proximate the wafer;
• and,
• oscillating the quartz rod while providing diluted ammonia water onto the surface of the wafer.