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US 2007/0180778 A1Published application
CMP Porous Pad with Component-Filled Pores
AssigneeCabot Microelectronics Corporation
InventorAbaneshwar Prasad
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Abstract
This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.
Claims14
A method for producing a chemical-mechanical polishing pad comprising:
- (i) providing a polymeric material comprising gas-filled pores,
- (ii) subjecting the polymeric material comprising to a pressure differential,
- (iii) contacting at least one surface of the polymeric material with a medium comprising a component selected from a liquid, a solid, or a mixture thereof.
- (iv) allowing the medium comprising the component to permeate at least a portion of the pores of the polymeric material, and
- (v) forming the polymeric material comprising component-filled pores into a chemical-mechanical polishing pad.
2 more elements
The method of claim 14, wherein the abrasive particles comprise metal oxide selected from the group consisting of alumina, silica, titania, ceria, zirconia, germania, magnesia, co-formed products thereof, and combinations thereof.
Dependencies are inferred from the claim text.