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US 2007/0178712 A1Published application
Planarization for Integrated Circuits
AssigneeTexas Instruments Incorporated
InventorMichael Brenner
Life of this patent
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Abstract
A method of planarizing a layer of an integrated circuit. In one embodiment, a liquid film is applied over the layer, using extrusion coating techniques. In another embodiment, the layer itself may be applied as a liquid film, using extrusion techniques.
Claims5
A method of providing a planarized layer of an integrated circuit, comprising:
- depositing a layer as a liquid film by means of extrusion;
- forming a recess in the layer;
- and
- forming a conductor within the recess in the layer.
1 more element
Dependencies are inferred from the claim text.