Vapor deposition system and vapor deposition method for an organic compound

A vapor deposition system comprising:

• (A) a plurality of vapor depositing sources;
• (B) a holding member for holding a substrate on which a film is to be formed;
• (C) a plurality of opening members each disposed between the vapor depositing sources and the substrate on which a film is to be formed, the plurality of opening members being independently disposed so as to correspond to the plurality of vapor depositing sources;
• (D) moving means for moving at least one of the substrate on which a film is to be formed, and, the vapor depositing sources and the opening members, in one direction in a plane in parallel with a plane including the held substrate on which a film is to be formed;
• and
• (E) a partitioning member disposed between the plurality of vapor depositing sources, wherein
• the plurality of vapor depositing sources are arranged along a direction in the plane, which is a direction intersecting the direction of the movement, and
• a width at a center of each of the openings in the direction of movement of the openings is smaller than that at ends of the each of the openings.

A method of manufacturing an organic light emitting device comprising a vapor deposition step of an organic compound,

• the vapor deposition step of an organic compound comprising the steps of:
• moving at least one of a substrate on which a film is to be formed, and, a plurality of vapor depositing sources and an opening member, in one direction in a plane in parallel with a plane including the substrate on which a film is to be formed;
• evaporating the organic compound from the vapor depositing sources;
• and
• making the evaporated organic compound pass through the opening member to form a film on the substrate on which a film is to be formed, wherein:
• the opening member has a plurality of openings provided therein;
• a width at a center of each of the openings in the one direction of the each of the openings is smaller than that at ends of the each of the openings, and
• the plurality of openings are each independently provided so as to correspond to the respective plurality of vapor depositing sources.