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US 2007/0178664 A1Published application
Shallow trench isolation structure and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsUway Tseng, Ching-Yu Chang
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Abstract
A shallow trench isolation structure has a trench formed in a substrate, a silicon oxynitride layer conformally formed on the sidewalls and bottom of the trench, and a high density plasma (HDP) oxide layer substantially filling the trench.
Claims14
A method of fabricating a shallow trench isolation structure, comprising:
- forming a trench in a substrate;
- forming an oxide liner on the sidewalls and bottom of the trench;
- forming a silicon oxynitride layer on the substrate and the sidewalls and bottom of the trench;
- and
- forming an oxide layer on the silicon oxynitride layer and substantially filling the trench by high density plasma chemical vapor deposition (HDPCVD).
2 more elements
Dependencies are inferred from the claim text.