Semiconductor Production Apparatus
OwnerTatehito Usui, Motohiko Yoshigai +2inventors
InventorsTatehito Usui, Motohiko Yoshigai, Kazuhiro Joo, Shigeru Nakamoto
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OwnerTatehito Usui, Motohiko Yoshigai +2inventors
InventorsTatehito Usui, Motohiko Yoshigai, Kazuhiro Joo, Shigeru Nakamoto
Estimating the term…
A semiconductor production apparatus and method for etching a semiconductor wafer arranged in a container and having a film on the surface thereof, by use of a plasma generated in the container. A temporal change of a quantity of an interference light is detected for at least two wavelengths obtained from the surface of the wafer for a predetermined time period of an etching process of the wafer, an etching quantity of the wafer is determined, which varies as long as the etching process proceeds, based upon a particular change arising in the interference light of plural pairs of wavelengths, the plural pairs of the wavelengths corresponding to the etching quantities, respectively.
A semiconductor production apparatus for etching a semiconductor wafer arranged in a container and having a film on the surface thereof, by use of a plasma generated in the container, comprising:
A semiconductor production method for etching a semiconductor wafer arranged in a container and having a film on the surface thereof, by use of a plasma generated in the container, comprising the steps of:
Dependencies are inferred from the claim text.