Apparatus, system, and method for thermal conduction interfacing

A system for thermal conduction interfacing, the system comprising:

• a heat generating device;
• a heat dissipating device;
• a thermal conduction interface packet comprising
• a first layer formed substantially of a pliable thermally conductive material,
• a second layer formed substantially of a pliable thermally conductive material and coupled at the edges to the first layer forming a pliable packet, and
• a plurality of thermally conductive particles disposed within the packet;
• and
• wherein the first layer conforms to the surface of the heat generating device, the second layer conforms to the surface of the heat dissipating device, and thermal energy is transferred from the first layer to the second layer through the thermally conductive particles.

A method for thermal conduction interfacing, the method comprising:

• providing a first layer formed substantially of a pliable thermally conductive material;
• coupling a second layer, formed substantially of a pliable thermally conductive material, to the edges of the first layer forming a pliable packet, wherein the first layer and the second layer conform to a set of thermal interface surfaces;
• and
• inserting a plurality of thermally conductive particles into the packet, wherein thermal energy is transferred from the first layer to the second layer through the thermally conductive particles.