Optical receiver module
AssigneeOpnext Japan, Inc.
InventorsOsamu Kagaya, Yukitoshi Okamura, Atsushi Miura, Michihide Sasada, Hideyuki Kuwano
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Abstract
A semiconductor chip on which a light receiving element is mounted, a preamplifier for amplifying an output signal from the light receiving element, and an insulating carrier substrate on which the light receiving element is mounted are connected such that the output signal from the light receiving element is input to the preamplifier through electrodes on the carrier substrate, and there are provided two electrodes, on the carrier substrate, having a capacitance value of 40 fF or more therebetween in a state where no light receiving element is mounted.
Claims20
An optical receiver module comprising:
- a light receiving element for converting an optical signal with a bit rate of approximately 10 Gbits/s into an electrical signal;
- and
- a preamplifier for amplifying said electrical signal,
- wherein said light receiving element is mounted on two electrodes for said mounting light receiving element of a carrier substrate, and the capacitance value between the two electrodes is 40 fF or more.
An optical receiver module comprising:
- a light receiving element for converting an optical signal with a bit rate of approximately 10 Gbits/s into an electrical signal;
- a carrier substrate on which said light receiving element is mounted;
- and
- a preamplifier for amplifying said electrical signal,
- wherein the capacitance value between two electrodes of said carrier substrate is 40% or more of the capacitance value between two electrodes of said light receiving element.
An optical receiver module comprising:
- a light receiving element for converting an optical signal with a bit rate of approximately 10 Gbits/s into an electrical signal;
- a carrier substrate on which said light receiving element is mounted;
- and
- a preamplifier for amplifying said electrical signal,
- wherein a first light receiving element mounting-position and a second light receiving element mounting-position are provided on said carrier substrate.
Dependencies are inferred from the claim text.