Communication product having impact-resistant structure and method for fabricating the same

Abstract

A communication product includes a circuit board, a shielding frame, a shielding case and an impact-resistant structure. The circuit board has at least an electronic component mounted thereon. The shielding frame is arranged on the circuit board and enclosing the electronic component. The shielding frame has a higher level than the electronic component with respect to the circuit board. The shielding case is secured to the shielding frame and shields the electronic component. The impact-resistant structure includes a first adhesive layer, a second adhesive layer, and a flexible layer sandwiched between the first adhesive layer and the second adhesive layer. The first adhesive layer and the second adhesive layer are attached onto the inner surface of the shielding case and the top surface of the electronic component, respectively.

Dependencies are inferred from the claim text.