Thermal interface apparatus

An apparatus for transferring heat from a computing element to a heat sink, comprising:

• a gasket defining a containment area within the gasket;
• a vapor barrier at least partially spread across the gasket;
• an insert positioned within the containment area and adjacent the gasket, the insert defining an aperture;
• a desiccant positioned within the containment area;
• and
• a thermal interface material positioned within the containment area.

A barrier for use with a thermal interface material, comprising:

• a gasket comprising:
• a sidewall having a first end and a second end;
• a first leg extending from the first end of the sidewall;
• a second leg extending from the second end of the sidewall;
• wherein
• the sidewall, first leg, and second leg are at least partially formed from a first metal;
• and
• the sidewall, first leg, and second leg form a C-shape.

A method for manufacturing an apparatus to transfer heat from a computing element to a heat sink, comprising the operations of:

• forming a desiccant;
• adhering the desiccant to the chip package such that a chip affixed to the chip package seats within the aperture;
• placing a gasket around the desiccant;
• applying a thermal interface material to at least one of the chip and the heat sink;
• removing an oxidant from the thermal interface material;
• and
• placing the heat sink atop the gasket.

A method for manufacturing an apparatus for containing a thermal interface material, comprising:

• resetting a desiccant;
• placing an adhesive on at least one of an insert and a chip package;
• adhering the insert to the chip package;
• positioning a insert within an aperture formed by the location features;
• placing a gasket about the insert;
• applying a thermal interface material to a surface of the chip;
• removing an oxidation from the thermal interface material;
• and
• seating a heat sink above the thermal interface material.