Embedded microchannel cooling package for a central processor unit
AssigneeSun Microsystems, Inc.
InventorsAli Monfarad, Ji Yang
Life of this patent
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AssigneeSun Microsystems, Inc.
InventorsAli Monfarad, Ji Yang
Estimating the term…
An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and indirect cooling of the heat-generating portion of the CPU with an embedded microchannel heat exchanger. The coolant package system for the CPU removes higher levels of heat indirectly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serves to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inletting and outletting cooling liquid into and out of the CPU package.
A method for identifying a location of an asset in a communication network, said network having at least a first receiver device and a second receiver device, each receiver device having a known position, said method comprising:
(canceled)
The method of claim 7 wherein, when said network comprises at least one additional receiver device, said estimating the asset's location further comprises:
A method for identifying a location of an asset in a communication network, said network having a first receiver device at a first station and a second receiver device at a second station, each receiver device having a known position, said method comprising:
(canceled)
A method for identifying a location of an asset in a communication network, said network having at least three receivers, said method comprising:
Dependencies are inferred from the claim text.