Back to results
US 2007/0176445 A1Published application
Apparatus and method for transferring wafers
OwnerJin-Sung Kiminventor
Life of this patent
Estimating the term…
Abstract
An apparatus for transferring wafers and a method thereof, including a robotic arm, a transfer blade affixed to the robotic arm for holding at least one wafer, a wafer sensor unit coupled to the transfer blade, the wafer sensor unit having the capability of determining a position of the wafer relative to an optimal wafer position, and a controller electrically connected to the wafer sensor unit to terminate transfer operation if the wafer deviates from the optimal wafer position.
Claims17
An apparatus for transferring wafers, comprising:
- a robotic arm;
- a transfer blade for holding at least one wafer, the transfer blade being affixed to the robotic arm;
- a wafer sensor unit coupled to the transfer blade, the wafer sensor unit having the capability of determining a position of the wafer relative to an optimal wafer position;
- and
- a controller electrically connected to the wafer sensor unit.
2 more elements
A method for controlling transfer of wafers, comprising:
- placing a wafer on a top surface of a transfer blade;
- operating a wafer sensor unit to determine a position of the wafer on the transfer blade relative to an optimal wafer position;
- transmitting a signal to a controller to indicate the position of the wafer on the transfer blade;
- and
- controlling a movement of the transfer blade with the wafer in response to the signal transmitted to the controller.
2 more elements
Dependencies are inferred from the claim text.