Wiring board and semiconductor apparatus
AssigneeSharp Kabushiki Kaisha
InventorYoshiki Sota
Life of this patent
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Abstract
A wiring board of the present invention includes a dummy wiring in a semiconductor-chip mount area on which a semiconductor chip is to be mounted. The dummy wiring is arranged in a manner such that all wiring-lines included in the dummy wiring each have a free end within the semiconductor-chip mount area. This prevents a defect due to vaporization and expansion of moisture inside a semiconductor apparatus, with a simple structure and without raising costs.
Claims6
A wiring board, having a first surface including a semiconductor-chip mount area on which a semiconductor chip is to be mounted and a second surface, opposite to the first surface, to which an external connection terminal is to be provided,
- the wiring board comprising:
- a dummy wiring, in the semiconductor-chip mount area, arranged in a manner such that a wiring line included in the dummy wiring has a free end within the semiconductor-chip mount area.
A wiring board having a first surface including a semiconductor-chip mount area on which a semiconductor chip is to be mounted and a second surface, opposite to the first surface, to which an external connection terminal is to be provided,
- the wiring board comprising:
- a dummy wiring, provided in the semiconductor-chip mount area, arranged in a manner such that, when a semiconductor chip is mounted, the dummy wiring is not closed under the semiconductor chip.
A semiconductor apparatus, comprising:
- a wiring board having a first surface including a semiconductor-chip mount area on which a semiconductor chip is mounted and a second surface, opposite to the first surface, on which an external connection terminal is provided,
- the wiring board comprising:
- a dummy wiring, in the semiconductor-chip mount area, arranged in a manner such that a wiring line included in the dummy wiring has a free end within the semiconductor-chip mount area.
Dependencies are inferred from the claim text.