Transistor, memory cell and method of manufacturing a transistor
OwnerPeng-Fei Wang, Rolf Weis +4inventors
InventorsPeng-Fei Wang, Rolf Weis, Joachim Nuetzel, Arnd Scholz, Alexander Sieck, Sigurd Zehner
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OwnerPeng-Fei Wang, Rolf Weis +4inventors
InventorsPeng-Fei Wang, Rolf Weis, Joachim Nuetzel, Arnd Scholz, Alexander Sieck, Sigurd Zehner
Estimating the term…
A transistor which can in particular be used in memory cells of a Dynamic Random Access Memory a memory cell and a method of manufacturing a transistor is disclosed. In one embodiment the transistor is a dual-fin field effect transistor. The transistor includes a first and a second source/drain regions, a channel connecting the first and second source/drain regions, a gate electrode for controlling an electrical current flowing between the first and second source/drain regions. The gate electrode is insulated from the channel by a gate dielectric, wherein the gate electrode is disposed in a gate groove extending in the substrate surface so that the channel comprises two fin-like channel portions extending between the first and second source/drain regions in a cross-sectional view taken perpendicularly to a line connecting the first and the second source/drain regions, the gate electrode delimiting each of the fin-like channel portions at one side thereof.
A transistor, which is at least partially formed in an active area defined in a semiconductor substrate, the active area being delimited at two sides thereof by isolation trenches filled with an insulating material, the transistor comprising:
A transistor, which is at least partially formed in a semiconductor substrate having a surface, the transistor comprising:
A memory cell which is at least partially formed in a semiconductor substrate, the memory cell comprising:
A method of manufacturing a transistor, comprising the steps of:
A memory cell which is at least partially formed in a semiconductor substrate, the memory cell comprising:
Dependencies are inferred from the claim text.