Semiconductor device and method of manufacturing semiconductor device

A method of manufacturing a semiconductor device which mounts a plurality of light emitting devices on a substrate, comprising the steps of:

• forming through electrodes in a plurality of portions in which the light emitting devices are disposed on the substrate;
• forming a seed layer on a surface of the substrate so as to be connected to the through electrodes;
• patterning a resist in a mounting region in which the light emitting devices are mounted;
• forming a partition wall for intercepting a light between the light emitting devices around the mounting region;
• removing the resist from the substrate;
• and
• disposing the light emitting devices in the mounting region.

A method of manufacturing a semiconductor device which mounts a plurality of light emitting devices on a substrate, comprising the steps of:

• forming a plurality of concave portions in a region on a surface of the substrate in which the light emitting devices are to be mounted, thereby leaving a partition wall between the concave portions;
• forming through electrodes in bottom parts of the concave portions;
• mounting the light emitting devices in the concave portions;
• and
• connecting terminals of the light emitting devices to the through electrode.