Apparatus having heating portion in chemical bath for substrate wet treatment and method of heating chemical for substrate wet treatment using the apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsByeong-chu Lee, Dong-chul Heo, Mo-hyun Cho
Life of this patent
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Abstract
There are provided an apparatus having a heating portion in a chemical bath for substrate wet treatment and a method of heating a chemical for substrate wet treatment using the apparatus. The apparatus includes a chemical bath containing a chemical for substrate wet treatment. A heating portion is installed in the chemical bath, and the heating portion includes a heating element and a housing accommodating the heating element. An inert gas is filled in the housing.
Claims19
An apparatus for wet treatment of a substrate, comprising:
- a chemical bath containing a chemical for treating the substance;
- a heating portion installed in the chemical bath, the heating portion including a heating element and a housing accommodating the heating element;
- and
- an inert gas filled in the housing.
A method of heating a chemical for wet treatment of a substrate, the method comprising:
- installing a heating portion in a chemical bath, the heating portion including a heating element and a housing accommodating the heating element;
- and
- filling the housing with an inert gas.
Dependencies are inferred from the claim text.