Method for packing solid organometallic compound and packed container
AssigneeTosoh Finechem Corporation
InventorsShizuo Tomiyasu, Kohichi Tokudome, Kenichi Haga
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Abstract
A method for packing a solid organometallic compound into a container for packing the compound is provided, wherein the solid organometallic compound can be stably supplied to a vapor phase epitaxial growth apparatus such as an MOCVD apparatus at a constant concentration for a long period of time. In the method for packing a solid organometallic compound into a container for packing, the compound is composed of grains having a grain size of 8 mm or less and the grains of the compound essentially comprise grains having a grain size of 2.5 to 6 mm.
Claims44
A method for packing a solid organometallic compound into a container for packing the solid organometallic compound, wherein
- a grain size of the solid organometallic compound is 8 mm or less and grains of the solid organometallic compound essentially comprise ones having a grain size of 2.5 to 6 mm.
Dependencies are inferred from the claim text.