Structure and method for increasing locking friction force on circuit board
AssigneeWistron Corporation
InventorChih-Feng Yeh
Life of this patent
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Abstract
A structure and method for increasing a locking friction force on a circuit board allow a connecting face to be disposed on at least one of upper and lower faces of a substrate at a clamped position, the connecting face having a multiple relative indented portions and raised portions interlacing structure so as to allow the connecting face to have a larger friction coefficient. Whereby, when the connecting face is clamped, a larger friction force is exerted thereon and a displacement relative to a clamper is rather not yielded.
Claims20
A structure for increasing a locking friction force on a circuit board, allowing a larger friction coefficient to be existed at a position where a substrate is clamped;
- comprising:
- said substrate, a connecting face being disposed on at least one of upper and lower faces thereof at said clamped position, said connecting face having a multiple relative indented portions and raised portions interlacing structure so as to allow said connecting face to have a larger friction coefficient, when said connecting face is clamped, a larger friction force being exerted thereon and a displacement relative to a clamper being rather not yielded.
A method for increasing a locking friction force on a circuit board, allowing a larger friction coefficient to be existed at a position where a substrate is clamped;
- comprising:
- Allowing a connecting face with a multiple relative raised portions and indented portions interlacing structure to be formed on at least one of upper and lower faces of said substrate at said clamped position so as to allow said connecting face to have a larger friction coefficient, when said connecting face is clamped, a larger friction force being exerted thereon and a displacement relative to a clamper being rather not yielded.
Dependencies are inferred from the claim text.