Method of wafer level packaging and cutting
OwnerShun-Ta Wanginventor
Life of this patent
Estimating the term…
Abstract
A packaging wafer having a plurality of cavities on an upper surface thereof is provided. A plurality of trenches is formed between the cavities, wherein the packaging wafer has a thickness greater than a depth of the trenches. The packaging wafer is bonded to an element wafer and a hermetical window is formed from each cavity. Then, a cutting process is performed and an unbound part of the packaging wafer is removed. Therefore, a wafer level package is formed. Finally, the wafer level package is divided into a plurality of individual packages.
Claims24
A method of wafer level packaging and cutting, comprising:
- providing a packaging wafer, the packaging wafer comprising a plurality of cavities on an upper surface thereof;
- performing a pre-cutting process upon the upper surface of the packaging wafer, and forming a plurality of trenches between the cavities and a plurality of partitions between the trenches and the cavities, wherein the packaging wafer has a thickness greater than a depth of the trenches;
- providing an element wafer, the element wafer comprising a plurality of devices and a plurality of bonding pads on a surface of the element wafer;
- bonding the partitions of the packaging wafer to the element wafer;
- and
- performing a cutting process along the trenches on a lower surface of the packaging wafer, thereafter removing an unbound part of the packaging wafer to expose the bonding pads of the element wafer, and consequently forming a wafer level package.
A method of wafer level packaging and cutting, comprising:
- providing a packaging wafer, the packaging wafer comprising a transparent substrate, a pattern disposed on an upper surface of the transparent substrate, and a plurality of cavities, which are defined by the pattern, disposed on the upper surface of the transparent substrate;
- performing a pre-cutting process upon an upper surface of the packaging wafer, and forming a plurality of trenches between the cavities and a plurality of partitions between the trenches and the cavities, wherein the packaging wafer has a thickness greater than a depth of the trenches;
- providing an element wafer, the element wafer comprising a plurality of devices and a plurality of bonding pads on a surface of the element wafer;
- aligning the packaging wafer and the element wafer, the cavities of the packaging wafer corresponding to the devices of the element wafer;
- performing a hermetical bonding process in which the partitions of the packaging wafer are bonded to the element wafer;
- performing a cutting process along the trenches on a lower surface of the packaging wafer, thereafter removing an unbound part of the packaging wafer, and consequently forming a wafer level package;
- and
- dividing the wafer level package into a plurality of individual packages.
Dependencies are inferred from the claim text.