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US 2007/0166643 A1Published application
Photosensitive resin composition and manufacturing method of semiconductor device using the same
AssigneeFUJIFILM Corporation
InventorsKenichiro Sato, Tsukasa Yamanaka, Tomotaka Tsuchimura
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Abstract
A positive photosensitive resin composition, which contains a polybenzoxazole precursor capable of increasing alkali solubility by an action of an acid, a triarylsulfonium salt and a sensitizer; and a method of manufacturing a semiconductor device using the composition.
Claims12
A positive photosensitive resin composition, which comprises:
- a polybenzoxazole precursor capable of increasing alkali solubility by an action of an acid;
- a triarylsulfonium salt;
- and
- a sensitizer.
1 more element
Dependencies are inferred from the claim text.