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US 2007/0166134 A1Published application
Substrate transfer method, substrate transfer apparatus and exposure apparatus
OwnerMotoko Suzukiinventor
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OwnerMotoko Suzukiinventor
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The present invention relates to a substrate transporting method that transports substrates such as wafers or reticles, a substrate transport apparatus, and an exposure apparatus for use in lithography of, for example, semiconductor integrated circuits, and it is an object of the present invention to efficiently heat a substrate. Furthermore, a substrate transporting method that, after transporting a substrate disposed in the ambient atmosphere into a vacuum chamber and drawing a vacuum therein, transports the substrate to a stage apparatus disposed in a vacuum atmosphere, comprises the step of: transporting the substrate, which is disposed in the ambient atmosphere, to the stage apparatus in a state wherein the substrate is held by a holding means, which can regulate the temperature of the substrate.
A substrate transporting method that, after transporting a substrate disposed in the ambient atmosphere into a vacuum chamber and drawing a vacuum therein, transports the substrate to a stage apparatus disposed in a vacuum atmosphere, comprising the step of:
A substrate transport apparatus that, after transporting a substrate disposed in the ambient atmosphere, into a vacuum chamber and drawing a vacuum therein, transports the substrate to a stage apparatus disposed in a vacuum atmosphere, comprising:
An exposure apparatus, comprising:
Dependencies are inferred from the claim text.