Semiconductor surface inspection apparatus, surface inspection method, and semiconductor manufacturing apparatus
OwnerAkio Ishikawainventor
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Abstract
A semiconductor surface inspection apparatus 20, for detecting a defect existing on a surface of a sample, based on an image captured of the surface of the sample to which prescribed processing is applied in a semiconductor manufacturing apparatus 1, comprises: a defect detection unit 28 which detects a defect in an image captured one of before and after the prescribed processing; and an image extraction unit 32 which extracts, from an image captured the other of after and before the prescribed processing, an image of a portion corresponding to the portion where the defect was detected by the defect detection unit 28.
Claims23
A semiconductor surface inspection apparatus for detecting a defect existing on a surface of a sample, based on an image captured of the surface of said sample to which prescribed processing is applied in a semiconductor manufacturing process, comprising:
- a defect detection unit which detects a defect in an image captured one of before and after said prescribed processing;
- and
- an image extraction unit which extracts, from an image captured the other of after and before said prescribed processing, an image of a portion corresponding to the portion where said defect was detected by said defect detection unit.
A semiconductor manufacturing apparatus for manufacturing a semiconductor device by applying prescribed processing to a sample in a semiconductor manufacturing process, comprising:
- a defect detection unit which detects a defect in an image of said sample captured one of before and after said prescribed processing;
- and
- an image extraction unit which extracts, from an image of said sample captured the other of after and before said prescribed processing, an image of a portion corresponding to the portion where said defect was detected by said defect detection unit.
A surface inspection method for detecting a defect existing on a surface of a sample, based on an image captured of the surface of said sample to which prescribed processing is applied in a semiconductor manufacturing process, wherein:
- a defect is detected in an image captured one of before and after said prescribed processing;
- and
- an image of a portion corresponding to the portion where said defect was detected is extracted from an image captured the other of after and before said prescribed processing.
Dependencies are inferred from the claim text.