Heat sink assembly
AssigneeNanya Technology Corporation
InventorsChun-Huang Yu, Ren-Hung Huang
Life of this patent
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Abstract
A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory module. The clip holds the first heat-dissipating sheet and the second heat-dissipating sheet between which the fully buffered dual inline memory module is sandwiched.
Claims20
A heat sink assembly for dissipating heat from a fully buffered dual inline memory module which comprises an advanced memory buffer, a memory chip and a passive electrical component, the heat sink assembly comprising:
- a first heat-dissipating sheet;
- a second heat-dissipating sheet;
- and
- a clip detachably clamping the first heat-dissipating sheet and the second heat-dissipating sheet;
- wherein the fully buffered dual inline memory module is sandwiched between the first heat-dissipating sheet and the second heat-dissipating sheet and the first heat-dissipating sheet comprises an embossed portion connected to the advanced memory buffer and is spaced apart from the memory chip.
A heat sink assembly for dissipating heat from a device, comprising:
- a first heat-dissipating sheet;
- a second heat-dissipating sheet;
- and
- a clip detachably clamping the first heat-dissipating sheet and the second heat-dissipating sheet;
- wherein the device is sandwiched between the first heat-dissipating sheet and the second heat-dissipating sheet, and the second heat-dissipating sheet comprises a plurality of embossed strips which extend in different directions.
Dependencies are inferred from the claim text.