Memory module assembly including a clip for mounting a heat sink thereon

A memory module assembly comprising:

• a rectangular printed circuit board having top and bottom faces and two long sides and two short sides between the long sides, one of the long sides defining a cutout therein;
• a heat-generating electronic component mounted on the top face of the printed circuit board;
• a heat sink mounted on the electronic component;
• a substantially U-shaped clip having a pressing portion pushing the heat sink toward the electronic component and a retaining portion engaging the bottom face of the printed circuit board and a curved portion interconnecting the pressing portion and the retaining portion and extending through the cutout.

A memory module assembly comprising:

• a printed circuit board having a top face and a bottom face opposite the top face;
• a substrate mounted on the top surface of the printed circuit board;
• a heat-generating electronic component mounted on the substrate;
• a heat sink mounted on the electronic component, having a pair of feet engaging with opposite sides of the substrate;
• and
• a substantially U-shaped clip clamping the heat sink and the bottom face of the printed circuit board to exert a pressing force urging the heat sink toward the electronic component.