Potting shell

A potting shell for a populated circuit board, including:

• a wall arrangement with a main wall, said wall arrangement defines a shell volume at least in one spatial direction, and in the directions perpendicular thereto, wherein:
• the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound;
• the volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound;
• and
• said main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of said flexible section.

An electronics module, comprising:

• a populated circuit board, which is arranged in a potting shell, and is potted therein with potting compound;
• said potting shell including:
• a wall arrangement with a main wall, said wall arrangement defines a shell volume at least in one spatial direction, and in the directions perpendicular thereto, wherein:
• the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound;
• the volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound;
• and
• said main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of said flexible section.

A measuring transmitter for registering a process parameter, comprising:

• a housing, in which an electronics module, is arranged which includes:
• a wall arrangement with a main wall, said wall arrangement defines a shell volume at least in one spatial direction, and in the directions perpendicular thereto, wherein:
• the circuit board is positionable in the shell volume, and can be potted in the shell volume with a potting compound;
• the volume between the circuit board and a main wall of the potting shell, running essentially parallel, at least sectionally, to the circuit board, can be filled with a potting compound;
• and
• said main wall has at least one flexible section, which, based on a thermal expansion of the potting compound, can be deformed perpendicular to the plane of said flexible section.