Substrate support having heat transfer system
AssigneeApplied Materials, Inc.
InventorsAndrew Nguyen, Wing Cheng, Hiroji Hanawa, Semyon Kats, Kartik Ramaswamy, Yan Ye, Kwok Wong, Daniel Hoffman, Tetsuya Ishikawa, Brian Lue
Life of this patent
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Abstract
A support for a substrate processing chamber comprises a fluid circulating reservoir comprising a channel having serpentine convolutions. A fluid inlet supplies a heat transfer fluid to the fluid circulating reservoir and a fluid outlet discharges the heat transfer fluid. In one version, the channel is doubled over to turn back upon itself.
Claims14
A substrate support comprising:
- (a) a substrate receiving surface;
- (b) a fluid circulating reservoir comprising a channel having serpentine convolutions;
- (c) a fluid inlet to supply a heat transfer fluid to the fluid circulating channel;
- and
- (d) a fluid outlet to discharge the heat transfer fluid from the fluid circulating channel.
A support according to claim 8 wherein the integral fins have an aspect ratio of height to thickness of at least about 10:1.
A support according to claim 9 wherein the channel comprises upper and lower walls, and the integral fins extends downwardly from the upper wall of the channel to define gaps with the lower wall.
Dependencies are inferred from the claim text.