Temperature-independent, linear on-chip termination resistance
AssigneeLattice Semiconductor Corporation
InventorsMou Lin, William Andrews, John Schadt
Life of this patent
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AssigneeLattice Semiconductor Corporation
InventorsMou Lin, William Andrews, John Schadt
Estimating the term…
In one embodiment of the invention, an integrated circuit, such as an FPGA, has one or more programmable termination schemes, each having a plurality of resistive termination legs connected in parallel, and a calibration circuit designed to control each termination scheme for process, voltage, and temperature (PVT) variations. The sense element in the calibration circuit and each resistive leg in each termination scheme has a transistor-based transmission gate connected in series with a non-silicided poly (NSP) resistor. The negative temperature coefficient of resistivity of each NSP resistor offsets the positive temperature coefficient of resistivity of the corresponding transmission gate to provide a temperature-independent sense element and temperature-independent termination legs. The temperature-independence and constant IV characteristic of the sense element and termination legs enable a single calibration circuit to simultaneously control multiple termination schemes operating at different termination voltage levels.
An integrated circuit having a termination scheme (e.g., 200) having at least one leg (e.g., 202) comprising a first resistive element (e.g., 206) having a positive temperature coefficient of resistivity connected to a second resistive element (e.g., 208) having a negative temperature coefficient of resistivity.
An integrated circuit comprising:
A method for controlling a termination scheme in an integrated circuit comprising:
Dependencies are inferred from the claim text.