High power module with open frame package
OwnerAlan Elbanhawy, Benny Tjiainventors
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Abstract
A semiconductor assembly is disclosed. The semiconductor assembly includes a multilayer substrate having at least two layers with conductive patterns insulated by at least two dielectric layers. The substrate includes a first surface and a second surface. A leadless package comprising a control chip is coupled to the multilayer substrate. A semiconductor die comprising a vertical transistor is coupled to the multilayer substrate. There are conductive structures on the second surface for attaching the substrate to a circuit board. The control chip and the semiconductor die are in electrical communication through the multilayer substrate.
Claims19
A semiconductor assembly comprising:
- a multilayer substrate having at least two layers with conductive patterns insulated by at least two dielectric layers, the substrate including a first surface and a second surface;
- a leadless package comprising a control chip coupled to the multilayer substrate;
- a semiconductor die comprising a vertical transistor coupled to the multilayer substrate;
- and
- conductive structures on the second surface for attaching the substrate to a circuit board,
- wherein the control chip and the semiconductor die are in electrical communication through the multilayer substrate.
A method for making a semiconductor assembly comprising:
- obtaining a multilayer substrate having at least two layers with conductive patterns insulated by at least two dielectric layers, the substrate including a first surface and a second surface;
- attaching a leadless package comprising a control chip to the multilayer substrate;
- attaching a semiconductor die comprising a vertical transistor to the multilayer substrate;
- and
- attaching structures on the second surface for electrically coupling the substrate to a circuit board.
Dependencies are inferred from the claim text.