Housing for electronic components

Abstract

A housing is formed in such a way that a plurality of chip trays each holding a plurality of semiconductor chips are stored in a storage tray, wherein the chip tray is formed by vertically connecting an upper unit and a lower unit, both of which have the same structure. The semiconductor chips are held between the upper unit and the lower unit of the chip tray, thus preventing two-dimensional movement thereof. When a plurality of housings each having the aforementioned structure are vertically combined together, a plurality of semiconductor chips can be further held between the upper unit of one housing and the lower unit of another housing. This makes it possible to simultaneously transport numerous semiconductor chips, whereby the semiconductor chips are each encapsulated in a surface mount chip package.

Dependencies are inferred from the claim text.