Closed-loop latent heat cooling method and capillary force or non-nozzle module thereof

A capillary force closed-loop latent heat cooling module, comprising:

• a cooling fluid, for absorbing the heat of an electronic component;
• a storage tank, for storing the cooling fluid;
• a vapor chamber, which is a region for accommodating the gas generated by the cooling fluid being boiling and vaporized after absorbing the heat of the electronic component;
• a condenser, for condensing the gasified cooling fluid into the cooling fluid in a liquid state;
• and
• a loop pipe, for connecting the storage tank, the vapor chamber, and the condenser into a closed loop, and including a liquid pipe, a vapor pipe, and a gasification pipe, wherein the liquid pipe connects the storage tank and the gasification pipe, connects the storage tank and the condenser, and serves as the pipe for the back flow of the storage tank itself;
• the vapor pipe connects the vapor chamber and the condenser;
• the gasification pipe connects between the liquid pipes, with two side surfaces being connected with the electronic component and the vapor chamber respectively, and a micro structure with capillary force is disposed in the gasification pipe to form a liquid film kept in a film boiling state.

A non-nozzle closed-loop latent heat cooling module, comprising:

• a cooling fluid, for absorbing the heat of an electronic component;
• a storage tank, for storing the cooling fluid;
• a vapor chamber, which is a region for accommodating the gas generated by the cooling fluid being boiling and vaporized after absorbing the heat of the electronic component;
• a condenser, for condensing the gasified cooling fluid to be the cooling fluid in a liquid state;
• and
• a loop pipe, for connecting the storage tank, the vapor chamber, and the condenser into a closed loop, and including a liquid pipe, a vapor pipe, and a gasification pipe, wherein the liquid pipe connects the storage tank and the gasification pipe, connects the storage tank and the condenser, and serves as the pipe for the back flow of the storage tank itself;
• the vapor pipe connects the vapor chamber and the condenser;
• the gasification pipe connects at the liquid pipes, with two side surfaces connecting the electronic component and the vapor chamber respectively, and a non-nozzle structure is employed in the gasification pipe to form a liquid film kept in the film boiling state.