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AssigneeNitto Denko Corporation
InventorsHitoshi Ishizaka, Daisuke Uenda, Daisuke Hanai
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An object is to provide a cleaning member for semiconductor apparatus which can easily remove, without fail, foreign matters adherent to inner parts of a semiconductor apparatus, can bear a clearly readable mark for lot management, and can be prevented from generating particles upon contact with the holding part of a wafer case. A cleaning member for semiconductor apparatus, characterized in that the cleaning member comprises a wafer 1 and formed on at least one side thereof a cleaning layer 2 made of a heat-resistant resin formed by thermally curing a poly(amic acid), and that the cleaning layer 2 has a part 12 where a wafer surface is exposed; and in particular a cleaning member for semiconductor apparatus having the constitution described above wherein that part 12 in the cleaning layer 2 in which a wafer surface is exposed is a part where the cleaning layer has been removed throughout the whole circular area having a given width ranging from the peripheral edge of the wafer toward the center thereof.
A cleaning member for semiconductor apparatus, which comprises a wafer and formed on at least one side thereof a cleaning layer made of a heat-resistant resin formed by thermally curing a poly(amic acid), and wherein the cleaning layer has a part wherein a wafer surface is exposed.
A process for producing a cleaning member for semiconductor apparatus, which comprises a wafer and formed on at least one side thereof a cleaning layer made of a heat-resistant resin formed by thermally curing a poly(amic acid), and wherein the cleaning layer has a part where a wafer surface is exposed, characterized by comprising:
Dependencies are inferred from the claim text.