Method and device for pre-treating surfaces of substrates to be bonded
OwnerMarkus Gabriel, Christian Ossmanninventors
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Abstract
The present invention provides a process and a device for treating the surfaces or bonding surfaces of substrates before bonding the substrates. In accordance with the invention, the surfaces of substrates to be bonded are treated with an atmospheric plasma before bonding. The surfaces of the substrates can thus be cleaned, chemically activated or removed. However, it is also possible to grow a layer by corresponding reactive plasma gases. The invention is advantageous in that bonded substrates can be produced in a simple and cost-saving manner, wherein a high adhesive strength can be achieved.
Claims37
A process for connecting at least two substrates (l, l′) by means of bonding after pretrearing at least one of the bonding surfaces, characterized in that for the pretreatment a plasma (2) is acting on the bonding surface under atmospheric pressure.
A device for pretreating the surfaces (bonding surfaces la) of substrates (1, 1′) before bonding comprising a device for generating a plasma (2) by corona discharge (8) between a high voltage electrode (3;
- 31, 32) and a counter electrode and further comprising a support (4, 4′) for arranging at least one substrate (1, 1′) in the plasma.
A device for pretreating the surfaces (bonding surfaces 1a) of substrates (1, 1′) before bonding comprising a means for generating a plasma (2) by corona discharge (8) with a high voltage electrode (3;
- 31, 32) and comprising a support (4, 4′), wherein at least one substrate (1, 1′) is arranged on the support (4, 4′) in the plasma.
Dependencies are inferred from the claim text.