Radiation-sensitive resin composition
AssigneeJsr Corporation
InventorsYukio Nishimura, Hiroyuki Ishii, Isao Nishimura, Eiichi Kobayashi
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Abstract
A radiation-sensitive resin composition suitable as a chemically-amplified resist useful for microfabrication utilizing various types of radiation such as deep ultraviolet rays represented by a KrF excimer laser or ArF excimer laser. The radiation-sensitive resin composition of the present invention comprises: (A) a resin comprising a recurring unit (1-1) shown by the following formula (I-1) and (B) a radiation-sensitive acid generator such as 1-(4-n-butoxynaphthyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate. The radiation-sensitive resin composition may further comprise (C) an acid diffusion controller such as phenylbenzimidazole.
Claims9
A radiation-sensitive resin composition comprising:
- (A) a resin which comprises a recurring unit (1-1) shown by the following formula (I-1):
- wherein R1a represents a hydrogen atom, a methyl group, a hydroxyalkyl group having 1-4 carbon atoms, or a perfluoroalkyl group having 1-4 carbon atoms, X1 and X2 individually represent a hydrogen atom, a fluorine atom, an alkyl group having 1-4 carbon atoms, or a fluoroalkyl group having 1-4 carbon atoms, 1 is an integer of 0-5, and n is an integer of 0-2, the resin being insoluble or scarcely soluble in alkali, but becoming alkali soluble by the action of an acid, and
- (B) a photoacid generator.
Dependencies are inferred from the claim text.