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US 2006/0232940 A1Published application
Method for mounting a switching module, switching module and pressure pad
AssigneeSiemens Aktiengesellschaft
InventorsKarl Smirra, Gunter Scheid, Georg Fischer, Arnoud Smit
Life of this patent
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Abstract
The invention relates to a method for producing a housing, wherein the base body of the housing (10) is initially separated from a hollow profile and a printed circuit board (1) is subsequently inserted into the base body of the housing (10). The base body of the housing (10) is then closed laterally with the aid of covering elements (6).
Claims19
1-23. (canceled)
A method for mounting a switching module, which comprises:
- providing a circuit support with flat sides, a basic housing element with walls and an interior formed with guide devices, and cover element for closing the basic housing element;
- inserting the circuit support into the basic housing element with the flat sides facing towards the walls of the basic housing element;
- inserting a longitudinally extended pressure strip between the circuit support and the basic housing element, bracing the pressure strip with a given compression force against a flat side of the circuit support, and guiding the pressure strip with the guide devices in the interior of the basic housing element;
- and
- closing the basic housing element with the cover elements.
2 more elements
Dependencies are inferred from the claim text.