Conductive line end extension
AssigneeInfineon Technologies AG
InventorsKlaus Herold, Erdem Kaltalioglu
Life of this patent
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Abstract
Semiconductor devices having conductive lines with extended ends and methods of extending conductive line ends by a variable distance are disclosed. An end of a first conductive feature of an interconnect structure is extended by a first distance, and an end of a second conductive feature of the interconnect structure is extended by a second distance, the second distance being different than the first distance. Ends of conductive features that are positioned close to adjacent conductive features are preferably not extended.
Claims25
A semiconductor device, comprising:
- a workpiece having a first circuit element and a second circuit element formed thereon, the first circuit element comprising a first contact region, the second circuit element comprising a second contact region;
- a first conductive feature disposed proximate the first circuit element, the first conductive feature including an end that is disposed over and makes electrical contact to the first contact region of the first circuit element, the end of the first conductive feature extending from the first conductive feature past the first contact region of the first circuit element by a first distance;
- and
- a second conductive feature disposed proximate the second circuit element, the second conductive feature including an end that is disposed over and makes electrical contact to the second contact region of the second circuit element, the end of the second conductive feature extending from the second conductive feature past the second contact region of the second circuit element by a second distance, the second distance being different than the first distance.
A method of manufacturing a semiconductor device, the method comprising:
- providing a workpiece;
- forming a plurality of circuit elements within or over the workpiece, the plurality of circuit elements comprising a first contact region and a second contact region;
- and
- forming an interconnect structure over the plurality of circuit elements, the interconnect structure comprising a first conductive feature and a second conductive feature, the first conductive feature being disposed over and making electrical contact to the first contact region, the second conductive feature being disposed over and making electrical contact to the second contact region, wherein an end of the first conductive feature extends beyond the first contact region by a first distance, and wherein an end of the second conductive feature extends beyond the second contact region by a second distance, the second distance being different than the first distance.
A method of designing a semiconductor device, the method comprising:
- designing a plurality of circuit elements;
- designing an interconnect structure to be disposed over the plurality of circuit elements and provide electrical connection to the plurality of circuit elements, the interconnect structure comprising a plurality of conductive features, each of the plurality of conductive features having at least one end;
- extending the at least one end of a first conductive feature of the interconnect structure by a first distance;
- and
- extending the at least one end of a second conductive feature of the interconnect structure by a second distance, the second distance being different than the first distance.
Dependencies are inferred from the claim text.