Semiconductor device and mask pattern
AssigneesKabushiki Kaisha Toshiba, Infineon Technologies AG
InventorsOsamu Arisumi, Yoshinori Kumura, Kazuhiro Tomioka, Ulrich Egger, Haoran Zhuang, Bum-ki Moon
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AssigneesKabushiki Kaisha Toshiba, Infineon Technologies AG
InventorsOsamu Arisumi, Yoshinori Kumura, Kazuhiro Tomioka, Ulrich Egger, Haoran Zhuang, Bum-ki Moon
Estimating the term…
A semiconductor device according to an aspect of the invention comprises a semiconductor substrate, and a capacitor that is provided above the semiconductor substrate and is configured such that a dielectric film is sandwiched between a lower electrode and an upper electrode, the dielectric film being formed of an ABO3 perovskite-type oxide that includes at least one of Pb, Ba and Sr as an A-site element and at least one of Zr, Ti, Ta, Nb, Mg, W, Fe and Co as a B-site element, wherein a radius of curvature of a side wall of the capacitor, when viewed from above or in a film thickness direction, is 250 [nm] or less, and a length of an arc with the radius of curvature is {250 [nm]×π/6 [rad]} or more.
A semiconductor device comprising:
A mask pattern that is configured such that a radius of curvature of a side wall of a capacitor, which is formed by sandwiching a dielectric film between a lower electrode and an upper electrode, is set at 250 [nm] or less and a length of an arc with the radius of curvature is set at {250 [nm]×π/6 [rad]} or more.
Dependencies are inferred from the claim text.