Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device comprising:

• providing a semiconductor element attached to a substrate with a photocatalytic layer and an adhesive layer interposed therebetween;
• and
• peeling the substrate from the semiconductor element by irradiating the photocatalytic layer with a light.

A method for manufacturing a semiconductor device comprising:

• providing a semiconductor element attached to a substrate with a photocatalytic layer interposed therebetween;
• and
• peeling the substrate from the semiconductor element by irradiating the photocatalytic layer with a light from a side of the substrate.

A method for manufacturing a semiconductor device comprising:

• providing a semiconductor element attached to a substrate with a photocatalytic layer and an adhesive layer interposed therebetween;
• and
• peeling the substrate from the semiconductor element by irradiating the photocatalytic layer with a light from a side of the substrate.

A method for manufacturing a semiconductor device comprising:

• providing a semiconductor element attached to a substrate with a photocatalytic layer interposed therebetween;
• and
• peeling the substrate from the semiconductor element by irradiating the photocatalytic layer with an ultraviolet light.

A method for manufacturing a semiconductor device comprising:

• providing a semiconductor element attached to a substrate with a photocatalytic layer and an adhesive layer interposed therebetween;
• and
• peeling the substrate from the semiconductor element by irradiating the photocatalytic layer with an ultraviolet light.