Methods for embedding conducting material and devices resulting from the methods
AssigneesInteruniversitair Microelektronica Centrum vzw (IMEC), Universiteit Gent
InventorsJan Vanfleteren, Dominique Brosteaux, Fabrice Axisa
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Abstract
Methods of producing a composite substrate and devices made by the methods are disclosed. One of the methods comprises providing a flexible sacrificial layer, producing one or more patterned conducting layers on the flexible sacrificial layer, bending the sacrificial layer into a predetermined shape, providing a stretchable and/or flexible material on top of and in between features of the one or more patterned layers.
Claims42
A method of producing a composite substrate, comprising:
- providing a flexible sacrificial layer;
- producing one or more patterned conducting layers on the flexible sacrificial layer, the one or more patterned layers comprising a plurality of patterned features;
- providing a stretchable and/or flexible material on top of and in between the patterned features;
- and
- removing the sacrificial layer.
A composite substrate, comprising:
- a stretchable and/or flexible material, and
- patterned features embedded in the stretchable and/or flexible material, the patterned features comprising one or more patterned conducting layers.
A method of producing a composite substrate, comprising:
- providing a sacrificial layer;
- providing a patterned resist layer on the flexible sacrificial layer;
- depositing a conducting layer in between the patterned resist layer such that the conducting layer is also patterned;
- removing the resist layer;
- providing a stretchable and/or flexible material on top of and between patterned features of the conducting layer;
- and
- removing the sacrificial layer.
Dependencies are inferred from the claim text.