Heat dissipating device

A heat dissipation device, comprising:

• a first component having a first fluid interface and a first heat conducting surface;
• wherein said first heat conducting surface is adapted to conduct heat from a heat source;
• a second component having a second fluid interface;
• wherein a first fluid cavity is formed by coupling said first fluid interface of said first component with said second fluid interface of said second component;
• an inlet port fluidly coupled to said first fluid cavity;
• an outlet port fluidly coupled to said first fluid cavity;
• wherein said first fluid cavity is adapted to flow cooling fluid from said inlet port to said outlet port;
• an array of first star pins coupled to said first fluid interface and positioned in said first fluid cavity;
• wherein the cross section of said first star pins has at least three concave faces;
• wherein the intersection of said concave faces on said first star pins form sharp edges;
• and
• an array of first truncated dimples placed in said first fluid interface;
• wherein said first truncated dimples are positioned between said first star pins.

A method of dissipating heat from a heat source, comprising:

• providing a heat dissipating device having a first and second component that couple to form a fluid cavity;
• providing an inlet and outlet port fluidly coupled to said fluid cavity;
• providing an array of first star pins positioned in said fluid cavity;
• wherein the cross section of said first star pins has at least three concave faces;
• wherein the intersection of said concave faces form sharp edges;
• providing an array of first truncated dimples in said first fluid cavity positioned between said first star pins;
• and
• transferring heat from said first component to a cooling fluid in said fluid cavity flowing between said inlet port and said outlet port.