Apparatus and method for cleaning a semiconductor wafer
AssigneeSamsung Electronics Co., Ltd.
InventorHun-Jung Yi
Life of this patent
Estimating the term…
Abstract
A cleaning apparatus is provided comprising a process chamber defining a work space, a supporter apparatus for rotating a wafer, the supporter apparatus being located in the work space and the wafer being mounted on the supporter apparatus such that a processing surface of the wafer is upwardly facing, an organic solvent supplying nozzle for supplying an organic solvent into the work space to the processing surface of the wafer mounted on the supporter apparatus, and a dry gas supplying nozzle for supplying an organic solvent vapor into the work space and forming an organic solvent atmosphere therein. Thus, water remaining on the wafer may be readily removed.
Claims24
A cleaning apparatus comprising:
- a process chamber defining a work space;
- a supporter apparatus for rotating a wafer, the supporter apparatus being located in the work space and the wafer being mountable on the supporter apparatus such that a processing surface of the wafer is upwardly facing;
- an organic solvent supplying nozzle for supplying an organic solvent into the work space to the processing surface of the wafer mounted on the supporter apparatus;
- and
- a dry gas supplying nozzle for supplying an organic solvent vapor into the work space and forming an organic solvent atmosphere therein.
A cleaning apparatus comprising:
- a process chamber defining a work space;
- a supporter apparatus for rotating a wafer, the supporter apparatus being located in work space and the wafer being mountable on the supporter apparatus such that a processing surface of the wafer is upwardly facing;
- and
- a total region supplying nozzle for supplying an organic solvent to a total processing surface of the wafer extending from a center region to a peripheral region.
A cleaning method comprising:
- providing a processing chamber defining a work space;
- loading a wafer on a supporter apparatus located in the work space such that a processing surface of the wafer is upwardly facing;
- introducing an organic solvent in a vapor state into the process chamber forming a drying atmosphere in the work space;
- and
- directing the organic solvent vapor onto the processing surface of the wafer while substantially simultaneously rotating the wafer.
Dependencies are inferred from the claim text.