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US 2006/0231119 A1Published application
Apparatus and method for cleaning a substrate
OwnerHan-Jung Yiinventor
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OwnerHan-Jung Yiinventor
Estimating the term…
An apparatus and method for cleaning a wafer are provided. According to various embodiments, deionized water can be activated by forming an electric field in a supply member through which the deionized water is supplied. The activated deionized water preferably contains radicals with excellent reactivity, in addition to ions. The activated deionized water is then preferably supplied to the cleaning chamber shortly after being activated, to thereby remove contaminants from the wafer. The activated deionized water can be used instead of or in addition to a chemical solution to clean the wafer. When used instead of a chemical solution, a rinsing process for removing the chemical solution from the wafer can be avoided and the costs and time associated with the cleaning process can be reduced.
An apparatus for treating a substrate, comprising:
An apparatus for cleaning a substrate, comprising:
A method for cleaning a substrate, comprising:
Dependencies are inferred from the claim text.