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US 2006/0223899 A1Published application
Removal of porogens and porogen residues using supercritical CO2
OwnerJoseph Hillman, Robert Kevwitchinventors
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Abstract
A method of and apparatus for treating a substrate to remove porogens and/or porogen residues form a dielectric layer using a processing chamber operating at a supercritical state is disclosed. In addition, other supercritical processes can be performed before and/or after the removal process.
Claims35
A method of processing a substrate having a patterned dielectric layer thereon, the method comprising the steps of:
- positioning the substrate on a substrate holder in a processing chamber;
- and
- performing a porogen removal process using a first supercritical fluid comprising supercritical CO2 and a porogen removal chemistry.
Dependencies are inferred from the claim text.