Integrated circuit and methods of redistributing bondpad locations

A method of redistributing bondpad locations of an integrated circuit, comprising:

• providing an integrated circuit comprising at least first and second inner lead bondpads;
• forming a first insulative passivation layer over the integrated circuit;
• forming a first bondpad-redistribution line over the first insulative passivation layer in electrical connection with the first inner lead bondpad through the first insulative passivation layer, the first bondpad-redistribution line comprising a first outer lead bondpad area;
• forming a second insulative passivation layer over the integrated circuit and the first bondpad-redistribution line, the second insulative passivation layer being formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the first bondpad-redistribution line;
• forming a second bondpad-redistribution line over the first insulative passivation layer in electrical connection with the second inner lead bondpad through the first insulative passivation layer, the second bondpad-redistribution line comprising a second outer lead bondpad area, at least a portion of the second bondpad-redistribution line being received over the second insulative passivation layer outline and over the first bondpad-redistribution line;
• and
• forming a third insulative passivation layer over the integrated circuit and the second bondpad-redistribution line, the third insulative passivation layer being formed to have a sidewall outline at least a portion of which is proximate to and conforms to at least a portion of the second bondpad-redistribution line, at least a portion of the third insulative passivation layer outline being received over the second insulative passivation layer outline and over the first bondpad-redistribution line.