US 2006/0223010 A1 · Positive type radiation-sensitive resin composition

Abstract

A positive type radiation-sensitive resin composition suitable as a chemically-amplified resist sensitive to active radiation particularly to deep ultraviolet rays represented by a KrF excimer laser, an ArF excimer laser, or an F2 excimer laser, excelling particularly in a process margin for the KrF excimer laser is provided. The positive type radiation-sensitive resin composition comprises a photoacid generator and an acid-labile group-containing resin which is insoluble or scarcely soluble in alkali, but becomes alkali-soluble by the action of an acid, wherein the photoacid generator is a mixed photoacid generator containing a photoacid generator of the following formula (1) and a photoacid generator which is at least one compound selected from sulfonyloxyimide and disulfonyldiazomethane.

Claims13

Dependent claims

A positive type radiation-sensitive resin composition comprising

(A) a photoacid generator and (B) an acid-labile group-containing resin which is insoluble or scarcely soluble in alkali, but becomes alkali-soluble by the action of an acid,
wherein (A) the photoacid generator comprises a mixed photoacid generator containing (A1) a photoacid generator of the following formula (1) and (A2) a photoacid generator which is at least one compound selected from the group consisting of sulfonyloxyimides and disulfonyldiazomethanes,
wherein R1 represents a same or different monovalent organic group containing fluorine atoms, or a fluorine atom, R2 represents a same or different monovalent organic group containing no fluorine atoms, or a hydrogen atom, n and m are integers of 1-5, and X− represents an anion of camphorsulfonic acid or nonafluorobutanesulfonic acid.

Dependencies are inferred from the claim text.

Positive type radiation-sensitive resin composition

Life of this patent

Positive type radiation-sensitive resin composition

Life of this patent

Abstract

Claims13